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For the Inventor, By the Inventor

Mie, Japan

Saburo Miyamoto

This inventor holds 14 USPTO granted patents and 1 published patent application. Top assignee: Nitto-Denko Corporation. Active years: 1998-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Saburo Miyamoto. Retrieved from https://idiyas.com/inventor/saburo-miyamoto

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 14 

% Patents Active = 28.6

Average Co-Inventor Count = 2.5

ph-index = 5

Forward Citations = 120(Granted Patents)


Location History:

  • Takatsuki, JP (1998)
  • Ibaraki, JP (1999 - 2001)
  • Mie-ken, JP (2006 - 2011)
  • Kameyama, JP (2011 - 2013)

Company Filing History:

goldMedal14 out of 3,946 
 
Nitto-Denko Corporation
 patents

Years Active: 1998-2013

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14 patents (USPTO):Explore Patents
1. 8349106 - Adhesive tape joining method and adhesive tape joining apparatus (2013-01-08),
2. 8097121 - Protective tape separation method and protective tape separation apparatus (2012-01-17),
3. 8062474 - Protective tape separation method and apparatus using the same (2011-11-22),
4. 7984737 - Adhesive tape cutting method and adhesive tape joining apparatus using the same (2011-07-26),
5. 7913735 - Adhesive tape joining apparatus (2011-03-29),
6. 7849900 - Apparatus for joining a separating adhesive tape (2010-12-14),
7. 7393757 - Method for separating semiconductor wafer from supporting member, and apparatus using the same (2008-07-01),
8. 7387951 - Method of dicing semiconductor wafer into chips, and apparatus using this method (2008-06-17),
9. 7384811 - Method of separating semiconductor wafer, and separating apparatus using the same (2008-06-10),
10. 7078316 - Substrate joining apparatus (2006-07-18),
11. 6235144 - Resist removing apparatus and method (2001-05-22),
12. 6099675 - Resist removing method (2000-08-08),
13. 5891298 - Method and apparatus for peeling protective adhesive tape from (1999-04-06),
14. 5759006 - Semiconductor wafer loading and unloading apparatus, and semiconductor (1998-06-02),

Title: The Innovative Contributions of Saburo Miyamoto

Introduction

Saburo Miyamoto is a prominent inventor based in Mie-ken, Japan. He has made significant contributions to the field of adhesive technologies, holding a total of 14 patents. His work focuses on improving methods and apparatuses related to adhesive tape and protective tape applications.

Latest Patents

Miyamoto's latest patents include an innovative adhesive tape joining method and an adhesive tape joining apparatus. This invention features a joint detector that identifies a joint in the adhesive tape supplied from a tape supply section. A computing unit then determines the optimal cutting position for removing the joint based on the detected results. The controller manages the mechanisms to operate in accordance with the computing unit's determinations, ensuring that the adhesive tape with the joint is cut and removed effectively.

Another notable patent is the protective tape separation method and apparatus. This invention involves detecting the surface height of a protective tape joined to a wafer on a separation table. The operation amount for approaching a joining member to the protective tape is calculated based on the detected information. The joining member is then controlled to approach the protective tape, allowing for the separation of the protective tape from the wafer while maintaining the height of the joining member.

Career Highlights

Miyamoto is currently employed at Nitto Denko Corporation, where he continues to innovate in adhesive technologies. His work has significantly advanced the efficiency and effectiveness of adhesive applications in various industries.

Collaborations

Miyamoto collaborates with talented coworkers, including Masayuki Yamamoto and Yukitoshi Hase. Their combined expertise contributes to the development of cutting-edge adhesive solutions.

Conclusion

Saburo Miyamoto's contributions to adhesive technology through his patents and work at Nitto Denko Corporation highlight his role as a leading inventor in the field. His innovative methods and apparatuses continue to influence the industry and improve adhesive applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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