The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 22, 2001
Filed:
Dec. 01, 1998
Masayuki Yamamoto, Ibaraki, JP;
Makoto Namikawa, Ibaraki, JP;
Eiji Toyoda, Ibaraki, JP;
Shigeji Kuroda, Ibaraki, JP;
Saburo Miyamoto, Ibaraki, JP;
Takao Matsushita, Ibaraki, JP;
Nitto Denko Corporation, Osaka, JP;
Abstract
A resist removing apparatus for removing an unwanted resist pattern from a surface of wafer W by applying an adhesive tape to the surface of wafer W having the resist patterns formed thereon, and separating the adhesive tape from the surface of wafer W. The apparatus includes an adhesive removing mechanism,for treating the surface of wafer W after the adhesive tape is separated therefrom. The adhesive removing mechanism,may be effective when constructed to jet ozone to the surface of wafer W heated, to irradiate the surface of wafer W heated, with ultraviolet rays, or to jet ozone to the surface of wafer W heated and irradiate the surface with ultraviolet rays.