The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7393757 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 01, 2008

Filed:

Sep. 14, 2004
Applicants:

Saburo Miyamoto, Mie-ken, JP;

Yukitoshi Hase, Mie-ken, JP;

Inventors:

Saburo Miyamoto, Mie-ken, JP;

Yukitoshi Hase, Mie-ken, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
Abstract

A work is suction-held by an upper suction chuck stage from the surface side of a supporting member, is moved upward to a predetermined height, and is heated in a state where the thickness direction of a both-faced adhesive sheet is not restricted, and a dicing tape is cooled. After lapse of predetermined heating time, the work is separated from the both-faced adhesive sheet whose adhesive strength is weaken, and drops to a lower suction chuck stage.


Find Patent Forward Citations

Miyamoto, Saburo. (2008). Method for separating semiconductor wafer from supporting member, and apparatus using the same (U.S. Patent No. 7393757). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7393757

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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