Ryu Harada

Title: Ryu Harada: Innovator in Multilayer Printed Wiring Technologies

Introduction

Ryu Harada is a notable inventor based in Shizuoka, Japan. He has made significant contributions to the field of multilayer printed wiring technologies. With a total of four patents to his name, Harada's work focuses on enhancing the performance and efficiency of electronic components.

Latest Patents

Harada's latest patents include innovations such as a multilayer printed wiring board, a multilayer metal-clad laminated board, and a resin-coated metal foil. The multilayer printed wiring board features one or more insulating layers and at least one conductive layer stacked alternately. These insulating layers include at least one liquid crystal polymer resin layer, ensuring that the volume percentage of this layer is maintained between 5 to 90%. Additionally, his thermosetting adhesive composition includes a vinyl compound, a maleimide resin, and a thermoplastic elastomer, with specific ratios that enhance the material's tensile strength and elongation properties.

Career Highlights

Throughout his career, Ryu Harada has worked with prominent companies such as Tomoegawa Co., Ltd. and Panasonic Intellectual Property Management Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the electronics sector.

Collaborations

Harada has collaborated with notable colleagues, including Jun Tochihira and Hiroaki Takahashi. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Ryu Harada's contributions to multilayer printed wiring technologies exemplify his dedication to innovation in the electronics field. His patents reflect a commitment to advancing technology and improving the efficiency of electronic components.