The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 18, 2020
Filed:
Jan. 24, 2017
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Tomoegawa Co., Ltd., Tokyo, JP;
Hiroaki Takahashi, Mie, JP;
Tomoyuki Aoki, Osaka, JP;
Kiyotaka Komori, Mie, JP;
Jun Tochihira, Shizuoka, JP;
Ryu Harada, Shizuoka, JP;
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;
TOMOEGAWA CO., LTD., Tokyo, JP;
Abstract
A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.