Jun Tochihira

Title: Innovator Jun Tochihira: Advancing Multilayer Technology

Introduction: Jun Tochihira, an accomplished inventor based in Shizuoka, Japan, has made significant contributions to the field of multilayer printed wiring technology. With a portfolio that includes 9 patents, Tochihira's innovations have the potential to transform electronic applications significantly.

Latest Patents: His latest patents include groundbreaking developments such as the multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil. The multilayer printed wiring board features alternate stacking of insulating and conductive layers, incorporating liquid crystal polymer resin layers. This unique design allows for variable percentages of the liquid crystal polymer resin layer, ranging from 5% to 90% by volume relative to the insulating layers. Additionally, his thermosetting adhesive composition patent details a blend of vinyl compounds, maleimide resin, and thermoplastic elastomers, engineered for enhanced tensile strength and flexibility.

Career Highlights: Throughout his career, Jun Tochihira has worked with prominent companies, including Tomoegawa Paper Co., Inc. and Tomoegawa Co., Ltd. His innovative spirit has driven him to pursue patents that focus on advanced materials and manufacturing processes, reflecting his commitment to enhancing technology.

Collaborations: Tochihira has collaborated with notable colleagues such as Osamu Oka and Ryu Harada. These partnerships have fostered a creative environment that has yielded significant advancements in multilayer technologies and materials science.

Conclusion: Jun Tochihira stands out as a leading inventor in the multilayer technology sphere. His patents not only advance the field but also pave the way for future innovations in electronics. With ongoing research and collaboration, Tochihira's trajectory promises exciting developments that will benefit the industry in the years to come.