The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 25, 2020
Filed:
Jan. 24, 2017
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Tomoegawa Co., Ltd., Tokyo, JP;
Yohsuke Ishikawa, Fukushima, JP;
Yoshiaki Esaki, Osaka, JP;
Takayoshi Ozeki, Osaka, JP;
Jun Tochihira, Shizuoka, JP;
Ryu Harada, Shizuoka, JP;
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;
TOMOEGAWA CO., LTD., Tokyo, JP;
Abstract
A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.