Fukushima, Japan

Yohsuke Ishikawa

USPTO Granted Patents = 4 

Average Co-Inventor Count = 4.2

ph-index = 1

Forward Citations = 6(Granted Patents)


Location History:

  • Mie, JP (2016)
  • Fukushima, JP (2020 - 2023)

Company Filing History:


Years Active: 2016-2023

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4 patents (USPTO):Explore Patents

Title: Yohsuke Ishikawa: Innovator in Metal-Clad Laminates and Printed Wiring Boards

Introduction

Yohsuke Ishikawa is a notable inventor based in Fukushima, Japan. He has made significant contributions to the field of materials science, particularly in the development of metal-clad laminates and printed wiring boards. With a total of 4 patents to his name, Ishikawa's work has had a considerable impact on the electronics industry.

Latest Patents

Ishikawa's latest patents include a metal-clad laminate and a method for manufacturing multilayer printed wiring boards. The metal-clad laminate features an insulating layer and a metal layer stacked on top of it. The insulating layer consists of a first layer and a second layer, with the first layer containing a cured product of a resin composition that includes composite particles. The second layer may or may not contain composite particles, with specific ratios defined for optimal performance.

The method for manufacturing multilayer printed wiring boards involves stacking sheets of metal foil and prepreg materials, followed by thermal curing to create a double-sided metal-clad laminate. This innovative approach allows for the formation of conductor wiring by partially removing the first sheet of metal foil, resulting in a highly efficient printed wiring board.

Career Highlights

Throughout his career, Ishikawa has worked with prominent companies such as Panasonic Intellectual Property Management Co., Ltd. and Tomoegawa Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in his field.

Collaborations

Ishikawa has collaborated with esteemed colleagues, including Takayoshi Ozeki and Yoshiaki Esaki. These partnerships have fostered a creative environment that has led to innovative solutions in the realm of electronics.

Conclusion

Yohsuke Ishikawa's contributions to the field of metal-clad laminates and printed wiring boards exemplify his dedication to innovation. His patents reflect a deep understanding of materials science and a commitment to advancing technology in the electronics industry.

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