The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 05, 2016

Filed:

Feb. 18, 2011
Applicants:

Takayoshi Ozeki, Osaka, JP;

Yohsuke Ishikawa, Mie, JP;

Yoshiaki Esaki, Osaka, JP;

Hiroyuki Fukusumi, Mie, JP;

Inventors:

Takayoshi Ozeki, Osaka, JP;

Yohsuke Ishikawa, Mie, JP;

Yoshiaki Esaki, Osaka, JP;

Hiroyuki Fukusumi, Mie, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 3/00 (2006.01); H05K 1/02 (2006.01); C08G 69/48 (2006.01); C08L 77/00 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01); C08G 59/54 (2006.01); C08G 59/62 (2006.01); C08L 63/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0281 (2013.01); C08G 59/54 (2013.01); C08G 59/623 (2013.01); C08G 69/48 (2013.01); C08L 63/00 (2013.01); C08L 77/00 (2013.01); H05K 1/0298 (2013.01); H05K 1/0326 (2013.01); H05K 1/0346 (2013.01); H05K 3/4655 (2013.01); H05K 1/0393 (2013.01); H05K 2201/0195 (2013.01);
Abstract

The flexible printed wiring board according to the present invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, a second single-layered insulating layer laminated on the first insulating layer, as it covers the first conductor wiring, and a second conductor wiring laminated on the second insulating layer. The first conductor wiring has a thickness in the range of 10 to 30 μm, a line width in the range of 50 μm to 1 mm, and a line gap in the range of 50 μm to 1 mm. The thickness from the surface of the first conductor wiring to the surface of the second insulating layer is in the range of 5 to 30 μm. The surface waviness of the part of the second insulating layer covering the first conductor wiring is 10 μm or less.


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