Hiroyuki Fukusumi

Title: Hiroyuki Fukusumi: Innovator in Flexible Printed Wiring Board Technology.

Introduction

Hiroyuki Fukusumi is a notable inventor based in Mie, Japan. He has made significant contributions to the field of flexible printed wiring boards, showcasing his expertise through innovative designs and patents. His work is particularly relevant in the electronics industry, where flexible circuits are increasingly in demand.

Latest Patents

Hiroyuki Fukusumi holds a patent for a flexible printed wiring board and laminate for the production of flexible printed wiring boards. This invention includes a first flexible insulating layer, a first conductor wiring laminated on the first insulating layer, and a second single-layered insulating layer laminated on the first insulating layer. The design features specific thicknesses and dimensions for the conductor wiring, ensuring optimal performance and reliability in electronic applications. He has 1 patent to his name.

Career Highlights

Fukusumi is associated with Panasonic Intellectual Property Management Co., Ltd., where he has been instrumental in advancing the company's technological capabilities. His work has not only contributed to the company's portfolio but has also set new standards in the industry for flexible wiring solutions.

Collaborations

Throughout his career, Hiroyuki Fukusumi has collaborated with talented individuals such as Takayoshi Ozeki and Yohsuke Ishikawa. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in the field of flexible electronics.

Conclusion

Hiroyuki Fukusumi's contributions to flexible printed wiring board technology highlight his role as a key innovator in the electronics industry. His patent and collaborative efforts continue to influence advancements in flexible circuit design and production.