The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 20, 2022

Filed:

Jul. 25, 2018
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Kazuki Matsumura, Mie, JP;

Yohsuke Ishikawa, Fukushima, JP;

Koji Kishino, Mie, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/46 (2006.01); C09J 7/35 (2018.01); C09J 7/10 (2018.01); B32B 15/02 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); B32B 27/20 (2006.01); B32B 27/38 (2006.01); B32B 37/06 (2006.01); B32B 37/10 (2006.01); C09J 5/06 (2006.01); C09J 11/02 (2006.01); B29C 70/42 (2006.01); B29K 63/00 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H05K 3/4673 (2013.01); B32B 15/02 (2013.01); B32B 15/092 (2013.01); B32B 15/20 (2013.01); B32B 27/20 (2013.01); B32B 27/38 (2013.01); B32B 37/06 (2013.01); B32B 37/10 (2013.01); C09J 5/06 (2013.01); C09J 7/10 (2018.01); C09J 7/35 (2018.01); C09J 11/02 (2013.01); B29C 70/42 (2013.01); B29K 2063/00 (2013.01); B29L 2031/3425 (2013.01); B32B 2307/206 (2013.01); B32B 2311/12 (2013.01); B32B 2363/00 (2013.01); B32B 2457/08 (2013.01); C09J 2203/326 (2013.01); C09J 2400/26 (2013.01); C09J 2463/00 (2013.01); H05K 2203/065 (2013.01);
Abstract

A first stack is formed by stacking a first sheet of metal foil, a first prepreg, and a second sheet of metal foil, one on top of another. The first prepreg is thermally cured by thermally pressing these members to make a double-sided metal-clad laminate. Conductor wiring is formed by partially removing the first sheet of metal foil from the double-sided metal-clad laminate to make a printed wiring board. After a third sheet of metal foil has been preheated, the conductor wiring of the printed wiring board, a second prepreg, and the third sheet of metal foil are stacked one on top of another and thermally pressed together. The first insulating layer has a lower linear expansion coefficient than any of the first sheet of metal foil or the second sheet of metal foil does.


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