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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10822527 B1

PDFFull Text
Date of Patent:
Nov. 03, 2020

Filed:

Jan. 19, 2016

Thermosetting adhesive composition, thermosetting adhesive film, and composite film

Applicant:

Tomoegawa Co., Ltd., Tokyo, JP;

Inventors:

Jun Tochihira, Yaizu, JP;

Ryu Harada, Shizuoka, JP;

Assignee:

Tomoegawa Co., Ltd., Tokyo, JP;

Attorney:

Wood Heeron & Evans LLP

Primary Examiner:

Callie E Shosho

Assistant Examiner:

Krupa Shukla

Int. Cl.
CPC ...
C09J 7/35 (2018.01); B32B 27/00 (2006.01); C09J 7/20 (2018.01); C09J 4/06 (2006.01); C08F 290/06 (2006.01); C08F 257/02 (2006.01); C09J 7/25 (2018.01); C09J 7/22 (2018.01); B32B 15/082 (2006.01); B32B 15/085 (2006.01); B32B 27/20 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); C08F 222/40 (2006.01); C08F 212/34 (2006.01);
U.S. Cl.
CPC ...
C09J 7/35 (2018.01); B32B 15/082 (2013.01); B32B 15/085 (2013.01); B32B 27/00 (2013.01); B32B 27/20 (2013.01); B32B 27/281 (2013.01); B32B 27/302 (2013.01); C08F 257/02 (2013.01); C08F 290/062 (2013.01); C09J 4/06 (2013.01); C09J 7/20 (2018.01); C09J 7/22 (2018.01); C09J 7/255 (2018.01); B32B 2270/00 (2013.01); B32B 2457/08 (2013.01); C08F 212/34 (2013.01); C08F 222/40 (2013.01); C09J 2203/326 (2013.01); C09J 2400/163 (2013.01); C09J 2400/226 (2013.01); C09J 2453/00 (2013.01); C09J 2467/006 (2013.01); C09J 2479/08 (2013.01);
Abstract

This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.

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