Tomoegawa Co., Ltd.

Panasonic Intellectual Property Management Co., Ltd.

Ryu Harada

Jun Tochihira

Hiroaki Takahashi

Kiyotaka Komori

Takayoshi Ozeki

Masaya Koyama

Yohsuke Ishikawa

Yoshiaki Esaki

Tomoyuki Aoki

A multilayer printed wiring board including one or more insulating layersand at least one conductive layerwhich are stacked alternately is disclosed. The one or more insulating layersinclude at least one liquid crystal polymer resin layerso that each of the one or more insulating layersincludes at least one layer selected from a group consisting of at least one polyolefin resin layerand the at least one liquid crystal polymer resin layer. A percentage by volume of the at least one liquid crystal polymer resin layerrelative to the one or more insulating layersis within a range of 5 to 90%.

Multilayer printed wiring board, multilayer metal-clad laminated board, and resin-coated metal foil

This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.

Thermosetting adhesive composition, thermosetting adhesive film, and composite film

A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.

Resin-clad metal foil and flexible printed wiring board

A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.

Growing community of inventors

Shizuoka, Japan

Ryu Harada