Tokyo, Japan

Ryohta Sasaki

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 5.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Location History:

  • Oyama, JP (2020)
  • Tokyo, JP (2021 - 2022)

Company Filing History:


Years Active: 2020-2022

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4 patents (USPTO):Explore Patents

Title: Ryohta Sasaki: Innovator in Semiconductor and FRP Technologies

Introduction

Ryohta Sasaki is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of semiconductor packaging and fiber-reinforced plastics (FRP). With a total of four patents to his name, Sasaki's work has had a notable impact on technology and manufacturing processes.

Latest Patents

Sasaki's latest patents include innovations such as a metal-clad laminate, a printed wiring board, and a semiconductor package. These inventions effectively suppress warping in materials. The metal-clad laminate comprises a prepreg with a resin composition attached to a fiber base material, adhering to specific formulas that ensure optimal performance. Additionally, he has developed a method for manufacturing an FRP precursor that enhances resin filling properties, allowing for better adhesion under atmospheric pressure.

Career Highlights

Throughout his career, Ryohta Sasaki has worked with notable companies, including Showa Denko Materials Co., Ltd. and Resonac Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in his field.

Collaborations

Sasaki has collaborated with esteemed colleagues such as Yukio Nakamura and Takeshi Saitoh. Their combined expertise has fostered innovation and advancement in their respective areas of research.

Conclusion

Ryohta Sasaki's contributions to semiconductor and FRP technologies highlight his role as a leading inventor in Japan. His patents reflect a commitment to innovation and excellence in engineering.

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