The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 08, 2022
Filed:
May. 24, 2017
Hitachi Chemical Company, Ltd., Tokyo, JP;
Yuji Tosaka, Tokyo, JP;
Takeshi Saitoh, Tokyo, JP;
Yukio Nakamura, Tokyo, JP;
Ryohta Sasaki, Tokyo, JP;
Hiroshi Shimizu, Tokyo, JP;
Ryoichi Uchimura, Tokyo, JP;
Showa Denko Materials Co., Ltd., Tokyo, JP;
Abstract
Provided are a metal-clad laminate, a printed circuit board, and a semiconductor package, wherein the warps therein are effectively suppressed. Specifically the metal-clad laminate comprises a prepreg, wherein the prepreg has a resin composition attached to a fiber base material and satisfies a following formula (1) as well as a Mowing formula (2), provided that in the formulae, a1 represents an average thickness of the resin composition after being cured which is present on one surface of the fiber base material; a2 represents an average thickness of the resin composition after being cured which is present on other surface of the fiber base material; and B represents an average thickness of the fiber base material.0.12<{(1+2)/2}/  (1)0.8≤1/2≤1.25  (2)