Company Filing History:
Years Active: 2021-2024
Title: Ryoichi Uchimura: Innovator in Laminate and Semiconductor Technologies
Introduction
Ryoichi Uchimura is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the fields of laminate technology and semiconductor packaging. With a total of three patents to his name, Uchimura's work has had a notable impact on the industry.
Latest Patents
Uchimura's latest patents include innovations in laminate structures, printed wiring boards, and semiconductor packages. One of his key inventions relates to a laminate that consists of multiple layers of a composite material, which includes a fiber substrate and a thermosetting resin composition. This invention aims to enhance the performance of laminates by utilizing different types of glass fibers with varying tensile elastic moduli. Another patent focuses on a metal-clad laminate that effectively suppresses warping, ensuring the reliability of printed circuit boards and semiconductor packages.
Career Highlights
Throughout his career, Uchimura has worked with notable companies such as Showa Denko Materials Co., Ltd. and Resonac Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to advancements in material science and engineering.
Collaborations
Uchimura has collaborated with talented individuals in his field, including coworkers Yuji Tosaka and Takeshi Saitoh. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.
Conclusion
Ryoichi Uchimura's contributions to laminate and semiconductor technologies exemplify the spirit of innovation. His patents reflect a commitment to enhancing material performance and reliability in electronic applications.