The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 01, 2020
Filed:
Jan. 13, 2017
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Yuji Tosaka, Chikusei, JP;
Takeshi Saitoh, Sakuragawa, JP;
Yukio Nakamura, Oyama, JP;
Ryohta Sasaki, Oyama, JP;
Hiroshi Shimizu, Tokyo, JP;
Assignee:
SHOWA DENKO MATERIALS CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 3/38 (2006.01); H05K 1/03 (2006.01); B32B 15/08 (2006.01); B32B 27/20 (2006.01); B32B 27/36 (2006.01); B32B 15/09 (2006.01); B32B 27/26 (2006.01); B32B 27/28 (2006.01); B32B 5/08 (2006.01); B32B 27/24 (2006.01); B32B 5/26 (2006.01); B32B 7/04 (2019.01); B32B 27/42 (2006.01); B32B 27/08 (2006.01); B32B 27/06 (2006.01); B32B 5/02 (2006.01); B32B 27/18 (2006.01); B32B 15/098 (2006.01); B32B 15/092 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/12 (2006.01); B32B 27/38 (2006.01); B32B 37/18 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/498 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 3/389 (2013.01); B32B 5/02 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/08 (2013.01); B32B 5/26 (2013.01); B32B 7/04 (2013.01); B32B 15/08 (2013.01); B32B 15/09 (2013.01); B32B 15/092 (2013.01); B32B 15/098 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); B32B 27/06 (2013.01); B32B 27/08 (2013.01); B32B 27/12 (2013.01); B32B 27/18 (2013.01); B32B 27/20 (2013.01); B32B 27/24 (2013.01); B32B 27/26 (2013.01); B32B 27/28 (2013.01); B32B 27/281 (2013.01); B32B 27/283 (2013.01); B32B 27/36 (2013.01); B32B 27/38 (2013.01); B32B 27/42 (2013.01); B32B 37/182 (2013.01); H01L 21/4857 (2013.01); H01L 23/145 (2013.01); H01L 23/49822 (2013.01); H01L 23/49883 (2013.01); H05K 1/03 (2013.01); H05K 1/0366 (2013.01); H05K 3/0014 (2013.01); H05K 3/4652 (2013.01); B32B 2250/05 (2013.01); B32B 2250/42 (2013.01); B32B 2255/02 (2013.01); B32B 2255/26 (2013.01); B32B 2260/021 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/02 (2013.01); B32B 2262/0223 (2013.01); B32B 2262/0246 (2013.01); B32B 2262/0269 (2013.01); B32B 2262/0276 (2013.01); B32B 2262/062 (2013.01); B32B 2262/10 (2013.01); B32B 2262/101 (2013.01); B32B 2262/14 (2013.01); B32B 2264/10 (2013.01); B32B 2264/101 (2013.01); B32B 2264/102 (2013.01); B32B 2264/104 (2013.01); B32B 2264/107 (2013.01); B32B 2270/00 (2013.01); B32B 2305/076 (2013.01); B32B 2307/206 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/718 (2013.01); B32B 2307/732 (2013.01); B32B 2311/12 (2013.01); B32B 2315/085 (2013.01); B32B 2363/00 (2013.01); B32B 2457/08 (2013.01); H05K 2201/0195 (2013.01); H05K 2203/1305 (2013.01);
Abstract
Provided are a prepreg including two or more fiber substrate layers and one or more resin composition layers, in which at least one of the one or more resin composition layers has a fiber substrate layer on each of both surfaces thereof, a printed circuit board using the prepreg and a method of producing the printed circuit board, and a semiconductor package.