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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Russell K Mortensen

This inventor holds 9 USPTO granted patents and 7 published patent applications. Top assignee: Intel Corporation. Active years: 2016-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Russell K Mortensen. Retrieved from https://idiyas.com/inventor/russell-k-mortensen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9 

% Patents Active = 77.8

Average Co-Inventor Count = 3.3

ph-index = 3

Forward Citations = 19(Granted Patents)


Company Filing History:

goldMedal9 out of 56,290 
 
Intel Corporation
 patents

Years Active: 2016-2026

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9 patents (USPTO):Explore Patents
1. 12733556 - Offset interposers for large-bottom packages and large-die package-on-package structures (2026-09-08),
2. 12690136 - Embedded passives with cavity sidewall interconnect in glass core architecture (2026-07-21),
3. 12107082 - Offset interposers for large-bottom packages and large-die package-on-package structures (2024-10-01),
4. 11978730 - Offset interposers for large-bottom packages and large-die package-on-package structures (2024-05-07),
5. 11798932 - Offset interposers for large-bottom packages and large-die package-on-package structures (2023-10-24),
6. 10607976 - Offset interposers for large-bottom packages and large-die package-on-package structures (2020-03-31),
7. 10453799 - Logic die and other components embedded in build-up layers (2019-10-22),
8. 10446530 - Offset interposers for large-bottom packages and large-die package-on-package structures (2019-10-15),
9. 9496211 - Logic die and other components embedded in build-up layers (2016-11-15),

Title: Innovator Spotlight: Russell K Mortensen, Pioneer in Offset Interposers

Introduction:

Russell K Mortensen is a distinguished inventor hailing from Chandler, AZ (US) with a keen eye for innovative solutions in electronics packaging. With a remarkable portfolio of 5 patents, Mortensen has made significant contributions to the field of semiconductor technology.

Latest Patents:

Among Mortensen's latest patents is the groundbreaking work on "Offset Interposers for Large-Bottom Packages and Large-Die Package-on-Package Structures." This invention features an offset interposer with distinct configurations on the land side and package-on-package side, enhancing the efficiency of interconnections in complex electronic packaging processes.

Career Highlights:

Mortensen's impressive career is closely tied to his affiliation with Intel Corporation, a global technology leader. Through his tenure at Intel, Mortensen has spearheaded projects that have pushed the boundaries of semiconductor design and packaging, solidifying his reputation as an industry trailblazer.

Collaborations:

In his professional journey, Mortensen has had the privilege of collaborating with esteemed colleagues such as Robert M Nickerson and Nicholas Randolph Watts. Together, they have worked on cutting-edge projects that have shaped the landscape of semiconductor innovations.

Conclusion:

Russell K Mortensen's inventive spirit and dedication to excellence have cemented his position as a pioneering figure in the realm of offset interposers. His commitment to driving technological advancements underscores his impact on the industry, making him a standout inventor in the field of electronics packaging.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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