This inventor holds 2 USPTO granted patents. Top assignees: Hauwei Device Co., Ltd., Sj Semiconductor (Jiangyin) Corporation. Active years: 2022-2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
2 out of 2 
1 out of 85 Years Active: 2022-2023
Title: Innovations by Inventor Rui Yu
Introduction
Rui Yu is a notable inventor based in Jiangyin, China. He has made significant contributions to the field of semiconductor technology, particularly in antenna packaging modules. With a total of two patents to his name, his work showcases innovative solutions that enhance the performance of electronic devices.
Latest Patents
Rui Yu's latest patents include an antenna packaging module and the method for making it. The first patent describes an antenna packaging module that consists of a redistribution layer, an antenna structure, a semiconductor chip, a third packaging layer, and a packaging antenna connector to an external circuit board. This design features a connector opening and at least a first and second antenna structure stacked on one surface of the redistribution layer. The packaging antenna connector is strategically designed to reduce antenna signal loss, eliminating the need for metal wire ends or a flip-chip process. The second patent further elaborates on the antenna packaging module for a semiconductor chip, emphasizing the electrical interconnection of the packaging antenna connector, which enhances the overall advantages of Wafer-Level Packaging (WLP) Antenna-in-Package (AiP) technology.
Career Highlights
Throughout his career, Rui Yu has worked with prominent companies in the technology sector. He has been associated with Huawei Device Co., Ltd. and Sj Semiconductor (Jiangyin) Corporation. His experience in these organizations has contributed to his expertise in semiconductor innovations.
Collaborations
Rui Yu has collaborated with notable colleagues, including Chengtar Wu and Chengchung Lin. Their combined efforts in the field of semiconductor technology have led to advancements in antenna packaging solutions.
Conclusion
Rui Yu's contributions to the field of semiconductor technology, particularly through his innovative antenna packaging modules, demonstrate his commitment to enhancing electronic device performance. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile