The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
Jul. 22, 2020
Sj Semiconductor (Jiangyin) Corporation, JiangYin, CN;
Huawei Device Co., Ltd., Dongguan, CN;
Chengtar Wu, JiangYin, CN;
Rui Yu, JiangYin, CN;
Chengchung Lin, JiangYin, CN;
Xianghui Zhang, JiangYin, CN;
SJ Semiconductor (Jiangyin) Corporation, Jiangyin, CN;
Hauwei Device Co., Ltd., Dongguan, CN;
Abstract
The application describes an antenna packaging module for a semiconductor chip and a method for making it. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a metal bump, a third packaging layer and a packaging antenna connector. The antenna structure comprises a connector opening, a first antenna structure and a second antenna structure stacked on the second surface of the redistribution layer. The packaging antenna connector is disposed in the connector opening, and is electrically connected to the redistribution layer. Electrical interconnection of packaging an antenna connector in a connector opening in the packaging layer, the antenna signal loss is reduced, and the overall e advantage of WLP AiP is further improved.