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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11626657 B1

PDFFull Text
Date of Patent:
Apr. 11, 2023

Filed:

Jul. 22, 2020

Antenna packaging module and making method thereof

Applicants:

Sj Semiconductor (Jiangyin) Corporation, JiangYin, CN;

Huawei Device Co., Ltd., Dongguan, CN;

Inventors:

Chengtar Wu, JiangYin, CN;

Rui Yu, JiangYin, CN;

Chengchung Lin, JiangYin, CN;

Xianghui Zhang, JiangYin, CN;

Assignee:

HAUWEI DEVICE CO., LTD, Guandong, CN;

Attorney:

Alston & Bird LLP

Primary Examiner:

Seung H Lee

Int. Cl.
CPC ...
H01Q 1/22 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/49822 (2013.01); H01L 23/49838 (2013.01); H01L 23/66 (2013.01); H01Q 1/2291 (2013.01); H01L 2223/6677 (2013.01);
Abstract

The present disclosure provides an antenna packaging module and the making method. The antenna packaging module comprises a redistribution layer, an antenna structure, a semiconductor chip, a third packaging layer, and a packaging antenna connector to an external circuit board. The antenna structure includes a connector opening and at least a first antenna structure and a second antenna structure stacked on one surface of the redistribution layer. The packaging antenna connector is designed in the connector opening and is electrically connected to the redistribution layer. Electrical terminals are provided through the packaging antenna connector disposed in the connector opening, thus reducing the antenna signal loss. The antenna packaging module requires neither any metal wire ends electrically connected to redistribution layer, nor a flip-chip process.

Find Patent Forward Citations

Wu, Chengtar. (2023). Antenna packaging module and making method thereof (U.S. Patent No. 11626657). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11626657

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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