San Francisco, CA, United States of America

Rudolf Schlangen

USPTO Granted Patents = 4 

 

Average Co-Inventor Count = 4.4

ph-index = 2

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 2014-2016

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4 patents (USPTO):Explore Patents

Title: Innovations by Rudolf Schlangen in Hot Spot Localization

Introduction

Rudolf Schlangen is an accomplished inventor based in San Francisco, CA, with a focus on advanced thermal analysis techniques. He holds four patents that contribute significantly to the field of electronic device architecture. His work primarily revolves around the non-destructive localization of buried hot spots, which is crucial for enhancing the performance and reliability of electronic devices.

Latest Patents

One of his latest patents is titled "Three-dimensional hot spot localization - A non-destructive approach for the 3D localization of buried hot spots in electronic device architectures by use of Lock-in Thermography (LIT)." This innovative method utilizes thermal wave propagation principles to analyze different material layers and determine the phase shift and thermal time delay. Schlangen's approach involves acquiring multiple LIT results at various excitation frequencies to achieve precise hot spot depth localization. Additionally, he employs multiple time-resolved thermal waveforms to expedite data acquisition and enhance detection accuracy. Another significant aspect of his work includes the use of lock-in thermal laser stimulation, where controlled heat is injected into a stacked die using a light beam, and the resulting thermal emissions are captured on the opposite side. This technique allows for the identification of defects, such as voids in vias, and can be repeated for each die in the stack to create a reference for future testing.

Career Highlights

Throughout his career, Rudolf Schlangen has worked with notable companies, including Dcg Systems GmbH and Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. His contributions to the field have been recognized for their innovative approach to thermal analysis and device reliability.

Collaborations

Some of his notable coworkers include Herve Deslandes and Frank Altmann, who have collaborated with him on various projects related to thermal imaging and electronic device architecture.

Conclusion

Rudolf Schlangen's work in hot spot localization represents a significant advancement in the field of electronic device architecture. His innovative patents and collaborations highlight his commitment to improving device performance and reliability through advanced thermal analysis techniques.

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