The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 04, 2015

Filed:

Apr. 02, 2014
Applicant:

Dcg Systems, Inc., Fremont, CA (US);

Inventors:

Herve Deslandes, Saint Martin d'Uriage, FR;

Rudolf Schlangen, San Francisco, CA (US);

Prasad Sabbineni, San Ramon, CA (US);

Antoine Reverdy, Grenoble, FR;

Ingrid De Wolf, Leuven, BE;

Assignee:

DCG SYSTEMS, INC., Fremont, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H04N 7/18 (2006.01); G06T 7/00 (2006.01); G01N 25/72 (2006.01); G01R 31/311 (2006.01); G01R 35/00 (2006.01); H04N 5/33 (2006.01);
U.S. Cl.
CPC ...
G06T 7/0008 (2013.01); G01N 25/72 (2013.01); G01R 31/311 (2013.01); G01R 35/005 (2013.01); H04N 5/33 (2013.01);
Abstract

Controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measuring with LIT camera from the other side of the die. The thermal image obtained can be characterized so that it can be used to calibrate the phase shift from a given stack layer, or can be used to identify defects in the stacked die. The process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can be investigated to detect faults, such as voids in vias, e.g., TSV.


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