Grenoble, France

Antoine Reverdy

USPTO Granted Patents = 3 

Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 10(Granted Patents)


Company Filing History:


Years Active: 2015-2018

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3 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Antoine Reverdy

Introduction

Antoine Reverdy is a notable inventor based in Grenoble, France. He has made significant contributions to the field of optical probing and thermal imaging, holding a total of three patents. His work focuses on enhancing the identification and localization of faulty devices within complex systems.

Latest Patents

One of Reverdy's latest patents is titled "Spectral mapping of photo emission." This invention discloses an apparatus and method for optical probing of a device under test (DUT). The system enables the identification, localization, and classification of faulty devices within the DUT. A selected area of the DUT is imaged while it receives test signals, which may be static or dynamic, causing certain active devices to modulate. Light from the DUT is collected and passed through a transparent diffracting grating before being imaged by a sensor and converted into an electrical signal. The resulting image includes both the zero order and first order diffraction of the grating. The grating is configured so that the zero order is in registration with emission sites imaged when the grating is outside the optical path.

Another significant patent involves "Lock-in thermal laser stimulation through one side of the device while acquiring lock-in thermal emission images on the opposite side." In this invention, a controlled amount of heat is injected into a stacked die using a light beam, and the propagated heat is measured with a lock-in thermal (LIT) camera from the other side of the die. The thermal image obtained can be characterized for calibration of the phase shift from a given stack layer or to identify defects in the stacked die. This process can be repeated for each die in the stack to generate a reference for future testing. The thermal image can also be investigated to detect faults, such as voids in vias, including through-silicon vias (TSV).

Career Highlights

Throughout his career, Antoine Reverdy has worked with several prominent companies, including Dcg Systems GmbH and FEI EFA, Inc. His experience in these organizations has contributed to his expertise in the field of optical and thermal imaging technologies.

Collaborations

Reverdy has collaborated with notable professionals in his field, including Herve Deslandes and Rudolf Schlangen. These collaborations have further enriched his work and innovations.

Conclusion

Antoine Reverdy's contributions to the field of optical probing

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