This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Nxp B.v.. Active years: 2012-2018.
Company Filing History:
Years Active: 2012-2018
Title: Roelf Groenhuis: Innovator in Semiconductor Packaging
Introduction
Roelf Groenhuis is a notable inventor based in Nijmegen, Netherlands. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative methods that enhance the efficiency and reliability of semiconductor devices.
Latest Patents
One of Roelf Groenhuis's latest patents is for a wafer level chip scale semiconductor package. This patent describes a method that involves providing a carrier with a cavity, forming electrical contacts, placing a semiconductor die, and encapsulating it. The process ensures that the electrical contacts are directly arranged on the encapsulation material after removing the carrier.
Another significant patent involves surface treatments for contact pads used in semiconductor chip packages. This invention introduces an inorganic solder mask that effectively prevents solder wetting on connection conductors when mounting chip packages to substrates. The method allows for a clean and efficient soldering process, ensuring that no extraneous solder solidifies on the exposed portions of the connection conductor.
Career Highlights
Roelf Groenhuis is currently employed at NXP B.V., a leading company in the semiconductor industry. His work at NXP has allowed him to push the boundaries of semiconductor technology and contribute to advancements in the field.
Collaborations
Throughout his career, Roelf has collaborated with esteemed colleagues such as Paul Dijkstra and Hans Van Rijckevorsel. These collaborations have fostered an environment of innovation and have led to the development of groundbreaking technologies in semiconductor packaging.
Conclusion
Roelf Groenhuis is a prominent figure in the semiconductor industry, known for his innovative patents and contributions to semiconductor packaging. His work continues to influence the field, making significant strides in technology and efficiency.