The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2012
Filed:
Nov. 03, 2006
Paul Dijkstra, Eindhoven, NL;
Hans Van Rijckevorsel, Ledeacker, NL;
Roelf Groenhuis, Nijmegen, NL;
NXP B.V., Eindhoven, NL;
Abstract
An inorganic solder mask () for use as a surface treatment in masking a connection conductor () of a semiconductor chip package () against solder wetting when mounting the chip package () to a printed wiring board () or other substrate. The connection conductor () is partially covered by a metallization contact () formed from a distinct metal. The inorganic solder mask () is applied to an exposed portion () of the connection conductor () not covered by the metallization contact (). The metallization contact () is not coated by the inorganic solder mask (). The presence of the inorganic solder mask () significantly reduces or prevents wetting of the exposed portion () when molten solder is present on the connection conductor () without affecting the solidified solder layer () formed on the metallization contact (). As a result, an extraneous mass of solder does not solidify on the exposed portion () of the connection conductor ().