Company Filing History:
Years Active: 2012-2021
Title: Hans van Rijckevorsel: Innovator in Semiconductor Technology
Introduction
Hans van Rijckevorsel, an inventive mind based in Ledeacker, Netherlands, has made significant contributions to the semiconductor industry. With a total of two patents to his name, his innovations are paving the way for advancements in semiconductor devices and packaging methods.
Latest Patents
Hans's most recent patents illustrate his expertise and creativity in semiconductor technology. The first patent focuses on a semiconductor device and method of making that device. It describes a semiconductor substrate featuring a major surface, a backside, and side surfaces that extend between these two. The device also incorporates at least one metal layer on the backside, with a critical design to prevent burrs at the peripheral edge affecting the mounting on a carrier's surface.
His second patent details surface treatments for contact pads in semiconductor chip packages. This innovation introduces an inorganic solder mask that masks connection conductors against solder wetting during assembly to a printed wiring board. The mask ensures that only the appropriate portions of the conductors are exposed, which significantly reduces the risk of extraneous solder masses that can obstruct functionality.
Career Highlights
Throughout his career, Hans van Rijckevorsel has worked with prominent companies in the semiconductor sector, including NXP B.V. and Nexperia B.V. His roles in these organizations have allowed him to refine his skills and contribute to important developments in the field.
Collaborations
Hans has collaborated with industry peers, notably Paul Dijkstra and Roelf Groenhuis. These partnerships have further strengthened his innovative solutions and have fostered an environment ripe for technological advancements.
Conclusion
Hans van Rijckevorsel stands out as a key figure in the semiconductor technology landscape. His patents not only highlight his inventiveness but also contribute significantly to the industry by addressing critical issues in device manufacturing and chip packaging. As he continues to innovate, his work promises to influence future developments in semiconductor technology significantly.