The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 18, 2021

Filed:

Nov. 03, 2016
Applicant:

Nexperia B.v., Nijmegen, NL;

Inventors:

Tonny Kamphuis, Lent, NL;

Leo van Gemert, Nijmegen, NL;

Hans van Rijckevorsel, Ledeacker, NL;

Sascha Moeller, Hamburg, DE;

Hartmut Buenning, Hamburg, DE;

Steffen Holland, Hamburg, DE;

Y Kuang Huang, Kang Shan/Kaohsiung, TW;

Assignee:

NEXPERIA B.V., Nijmegen, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/492 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 21/3205 (2006.01); H01L 21/683 (2006.01); H01L 23/528 (2006.01); H01L 23/00 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3114 (2013.01); H01L 21/32051 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/528 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H01L 29/0657 (2013.01); H01L 2221/68327 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01022 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/10156 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/35 (2013.01); H01L 2924/37 (2013.01);
Abstract

A semiconductor device and a method of making the same. The device includes a semiconductor substrate having a major surface, a backside and side surfaces extending between the major surface and the backside. The semiconductor device also includes at least one metal layer extending across the backside of the substrate. A peripheral part of the at least one metal layer located at the edge of the substrate between the backside and at least one of the side surfaces extends towards a plane containing the major surface. This can prevent burrs located at the peripheral part of the at least one metal layer interfering with the mounting of the backside of the substrate on the surface of a carrier.


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