Nxp B.v.

Roelf Groenhuis

Tonny Kamphuis

Leo Van Gemert

Paul Dijkstra

Jan Gulpen

Hans Van Rijckevorsel

This disclosure relates to a method of forming a wafer level chip scale semiconductor package, the method comprising: providing a carrier having a cavity formed therein; forming electrical contacts at a base portion and sidewalls portions of the cavity; placing a semiconductor die in the base of the cavity; connecting bond pads of the semiconductor die to the electrical contacts; encapsulating the semiconductor die; and removing the carrier to expose the electrical contacts, such that the electrical contacts are arranged directly on the encapsulation material.

Wafer level chip scale semiconductor package

An inorganic solder mask () for use as a surface treatment in masking a connection conductor () of a semiconductor chip package () against solder wetting when mounting the chip package () to a printed wiring board () or other substrate. The connection conductor () is partially covered by a metallization contact () formed from a distinct metal. The inorganic solder mask () is applied to an exposed portion () of the connection conductor () not covered by the metallization contact (). The metallization contact () is not coated by the inorganic solder mask (). The presence of the inorganic solder mask () significantly reduces or prevents wetting of the exposed portion () when molten solder is present on the connection conductor () without affecting the solidified solder layer () formed on the metallization contact (). As a result, an extraneous mass of solder does not solidify on the exposed portion () of the connection conductor ().

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Nijmegen, Netherlands

Roelf Groenhuis