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For the Inventor, By the Inventor

Oceanside, CA, United States of America

Robert V Hutchison

This inventor holds 7 USPTO granted patents. Top assignee: Burroughs, Inc.. Active years: 1976-1979.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Robert V Hutchison. Retrieved from https://idiyas.com/inventor/robert-v-hutchison

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 7

% Patents Active = 100.0

Average Co-Inventor Count = 1.6

ph-index = 6

Forward Citations = 170(Granted Patents)


Location History:

  • Oceanside, CA (US) (1976 - 1978)
  • Valley Center, CA (US) (1979)

Company Filing History:

goldMedal7 out of 1,222 
 
Burroughs, Inc.
 patents

Years Active: 1976-1979

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7 patents (USPTO):Explore Patents
1. 4132856 - Process of forming a plastic encapsulated molded film carrier CML (1979-01-02),
2. 4115836 - Cooling system for dual-in-line packages (1978-09-19),
3. 4104700 - Heat pipe cooling for semiconductor device packaging system (1978-08-01),
4. 4070084 - Controlled impedance connector (1978-01-24),
5. 4046442 - Pluggable semiconductor device package (1977-09-06),
6. 3999827 - Electrical connector for semiconductor device package (1976-12-28),
7. 3984166 - Semiconductor device package having lead frame structure with integral (1976-10-05),

Title: The Innovative Contributions of Robert V Hutchison

Introduction

Robert V Hutchison is a notable inventor based in Oceanside, California. He has made significant contributions to the field of electronic integrated circuit packaging, holding a total of seven patents. His work has advanced the technology used in the manufacturing and cooling of integrated circuits, showcasing his expertise and innovative spirit.

Latest Patents

Hutchison's latest patents include a process for forming a plastic encapsulated molded film carrier. This process involves packaging an electronic integrated circuit with a film carrier that has metallized connector leads. The method ensures that the integrated circuit is hermetically sealed and includes steps for testing the die for electrical performance. Another notable patent is a cooling system for dual-in-line packages, which utilizes a heat sink plate and a cooling frame to effectively dissipate heat generated by the integrated circuits.

Career Highlights

Throughout his career, Hutchison has worked with Burroughs, Inc., where he has been able to apply his innovative ideas to real-world applications. His patents reflect a deep understanding of both the technical and practical aspects of electronic packaging, making him a valuable asset to his company and the industry.

Collaborations

Hutchison has collaborated with several talented individuals, including John A Nelson and Peter P Gregg. These partnerships have likely contributed to the successful development of his patented technologies.

Conclusion

Robert V Hutchison's contributions to the field of electronic integrated circuit packaging are significant and impactful. His innovative patents and collaborative efforts highlight his dedication to advancing technology in this area.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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