The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 1978
Filed:
Apr. 25, 1977
Robert V Hutchison, Oceanside, CA (US);
Peter P Gregg, Vista, CA (US);
James J MacBride, Carlsbad, CA (US);
Burroughs Corporation, Detroit, MI (US);
Abstract
A cooling system for integrated circuit packaging of the conventional dual-in-line (DIP) type including a carrier heat sink plate which form web sections which engage the bodies of the DIP held side-by-side thereon. The plate is thermally and mechanically connected by means of a clamping device to a cooling frame in which a serpentine tubing carries coolant throughout spaced apart sections thereof, so that the heat generated by the DIP's is carried away by the heat sink plate into the frame sections where the coolant circulate. The DIP pins are electrically connected to a printed circuit board and to relatively flat flexible ribbon type printed circuit type cable the latter being clamped at each end into a standard connector which itself is clamped to an island printed circuit board having conductors thereon for connecting the DIP's to other electronic devices. Multiplicity of these DIP's so mounted in the cooling frame may be housed in the same console or housing along with other DIP islands as desired.