Peter P Gregg

Title: Innovations by Peter P. Gregg

Introduction

Peter P. Gregg is a notable inventor based in Vista, CA (US). He has made significant contributions to the field of integrated circuit packaging, holding 2 patents that showcase his innovative designs and solutions.

Latest Patents

One of his latest patents is a cooling system for dual-in-line packages. This system includes a carrier heat sink plate that forms web sections engaging the bodies of the dual-in-line packages (DIP) held side-by-side. The plate is thermally and mechanically connected to a cooling frame, where serpentine tubing carries coolant throughout spaced sections. This design effectively dissipates heat generated by the DIPs, ensuring efficient operation.

Another significant patent is for a heat pipe cooling system for semiconductor device packaging. This system is designed for high-density integrated circuits in computer systems. It features a cooling frame with multiple heat pipes and sub-islands that attach to printed circuit boards. The design allows for modular connections, enabling easy testing, repair, or replacement of sub-islands without dismantling the entire system.

Career Highlights

Peter P. Gregg has worked at Burroughs, Inc., where he has applied his expertise in developing advanced cooling systems for electronic devices. His work has contributed to enhancing the performance and reliability of integrated circuits in various applications.

Collaborations

Peter has collaborated with notable coworkers, including Robert V. Hutchison and James J. MacBride. Their combined efforts have led to innovative solutions in the field of electronics.

Conclusion

Peter P. Gregg's contributions to integrated circuit packaging through his patents demonstrate his commitment to innovation in the electronics industry. His work continues to influence the design and functionality of electronic devices today.