Company Filing History:
Years Active: 1978
Title: Innovations by James J MacBride
Introduction
James J MacBride is a notable inventor based in Carlsbad, CA (US). He has made significant contributions to the field of integrated circuit packaging, holding a total of 2 patents. His work focuses on innovative cooling systems that enhance the performance and reliability of electronic devices.
Latest Patents
One of MacBride's latest patents is a cooling system for dual-in-line packages. This system includes a carrier heat sink plate that engages the bodies of the dual-in-line packages (DIP) held side-by-side. The heat sink plate is thermally and mechanically connected to a cooling frame, which contains serpentine tubing that circulates coolant. This design effectively dissipates heat generated by the DIPs, ensuring optimal performance.
Another significant patent is for a heat pipe cooling system for semiconductor device packaging. This system features a cooling frame with multiple heat pipes that span the space within the frame. Each sub-island comprises a printed circuit board with connectors for integrated circuit packages. The design allows for efficient heat transfer and maintains a uniformly low temperature for the integrated circuit packages.
Career Highlights
James J MacBride has worked at Burroughs, Inc., where he has applied his expertise in electronic cooling systems. His innovative designs have contributed to advancements in the reliability and efficiency of computer systems.
Collaborations
MacBride has collaborated with notable coworkers, including Robert V Hutchison and Peter P Gregg. Their combined efforts have led to significant advancements in the field of integrated circuit packaging.
Conclusion
James J MacBride's contributions to the field of electronics through his innovative cooling systems have made a lasting impact. His patents reflect a commitment to enhancing the performance of integrated circuits, ensuring that technology continues to evolve.