Process of forming a plastic encapsulated molded film carrier cml

Abstract

A process of packaging an electronic integrated circuit which comprises a film carrier having metallized connector leads formed thereon to provide the connector leads for the integrated circuit (a hermetically sealed bumped die); gang-bonding the die to said leads; preferably testing the die and bounding thereof for electrical performance, continuity, etc.; placing a metal heat sink having a raised die attach area and a pair of pedestals coextensive with said film carrier into a transfer mold with the leads remaining planar; epoxy bonding said die to said die attach area concurrently soldering selected leads to said pedestals; and completely encapsulating said die in plastic while in said mold allowing said plastic to flow freely on both sides of the die attach area and over most of said heat sink to prevent warpage of the package when said plastic and metal cools but leaving the outer edges of said leads, not connected to said pedestals, open and free of plastic. In one embodiment, a leadless type package is formed by the process with the heat sink having means for liquid or change of state cooling, and in another embodiment an air cooled leadless type package is formed by the process.