Company Filing History:
Years Active: 1976-1987
Title: John A. Nelson: Innovator in Integrated Circuit Technology
Introduction
John A. Nelson is a notable inventor based in San Diego, CA, recognized for his contributions to integrated circuit technology. With a total of 4 patents to his name, Nelson has made significant advancements in the field, particularly in the design and functionality of integrated circuit packages.
Latest Patents
Among his latest innovations is the "Magnetically Sealed Multichip Integrated Circuit Package." This invention features a substrate with a cavity designed to hold multiple integrated circuit die. It includes a lid that protects the die, a ferromagnetic seal ring fixed to the substrate, and a magnet on the lid that attracts the seal ring, ensuring a secure closure. Another significant patent is the "Integrated Circuit Package Incorporating Low-Stress Omnidirectional Heat." This design introduces a heat sink made from a single thin sheet of material, featuring finger-shaped portions that extend radially to function as cooling fins, enhancing the thermal management of integrated circuit packages.
Career Highlights
John A. Nelson has spent a considerable part of his career at Burroughs, Inc., where he has been instrumental in developing innovative solutions for integrated circuits. His work has not only advanced the technology but has also contributed to the efficiency and reliability of electronic devices.
Collaborations
Throughout his career, Nelson has collaborated with talented individuals such as Robert V. Hutchison and Terrence Evan Lewis. These partnerships have fostered a creative environment that has led to groundbreaking inventions in the field of integrated circuits.
Conclusion
John A. Nelson's contributions to integrated circuit technology exemplify the spirit of innovation. His patents reflect a commitment to enhancing electronic device performance and reliability. His work continues to influence the industry and inspire future advancements in technology.