The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 05, 1976

Filed:

May. 07, 1975
Applicant:
Inventor:

Robert V Hutchison, Oceanside, CA (US);

Assignee:

Burroughs Corporation, Detroit, MI (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ; H05K / ;
U.S. Cl.
CPC ...
339 / ; 174 / ; 174 / ;
Abstract

A semiconductor device package which can be readily mounted on a printed circuit board without requiring soldering or intermediate connectors. A supporting substrate has a unique lead frame configuration thereon in which the leads extend around side portions of the substrate and form integral spring contacts projecting from the lower surface of the substrate. The package preferably includes a metallic stud having a head portion mounted in the substrate for receiving a semiconductor device and a rod portion extending from the lower surface of the substrate. The rod portion of the stud can be removably secured in an aperture in a printed circuit board to engage the spring contacts with corresponding conductors on the circuit board.


Find Patent Forward Citations

Loading…