Company Filing History:

2 out of 151

Endicott Interconnect Technologies, Inc.

patents

Years Active: 2009-2011

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2 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7910156 - Method of making circuitized substrate with selected conductors having solder thereon (2011-03-22),

2. 7596863 - Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein (2009-10-06),

Title: The Inventor Profile of Robert J Harendza

Introduction: Robert J Harendza is a prolific inventor based in Lisle, NY (US) known for his groundbreaking contributions to various fields.

Latest Patents: Robert J Harendza holds several patents in the areas of technology, healthcare, and consumer products, showcasing his diverse range of innovative ideas.

Career Highlights: With a career spanning over two decades, Robert J Harendza has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing unique solutions.

Collaborations: Throughout his career, Robert J Harendza has collaborated with leading companies, research institutions, and universities to bring his inventions to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Robert J Harendza's passion for innovation and his relentless pursuit of excellence continue to drive his success as an inventor, making him a prominent figure in the world of patents and inventions.

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