Endicott Interconnect Technologies, Inc.

Robert J Harendza

Robert Maynard Japp

John Joseph Konrad

Ashwinkumar C Bhatt

Norman A Card

Jose A Rios

Susan Pitely

Tonya L Mosher

A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder covered conductors. In one embodiment, the solder may be applied in molten form by immersing the substrate within a bath of the solder while in another the solder may be deposited using a screening procedure.

Method of making circuitized substrate with selected conductors having solder thereon

A method of making a printed circuit board in which at least three substrates are aligned and bonded together (e.g., using lamination). Two of the substrates have openings formed therein, with each opening including a cover member located therein. During lamination, the cover members for a seal and prevent dielectric material (e.g., resin) liquefied during the lamination from contacting the conductive layers on the opposed surfaces of the inner (first) substrate. A PCB is thus formed with either a projecting edge portion or a plurality of cavities therein such that electrical connection may be made to the PCB using an edge connector or the like.

Method of providing a printed circuit board with an edge connection portion and/or a plurality of cavities therein

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Lisle, NY, United States of America

Robert J Harendza