The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2011
Filed:
Mar. 30, 2007
Norman A. Card, Lockwood, NY (US);
Robert J. Harendza, Lisle, NY (US);
John J. Konrad, Endicott, NY (US);
Tonya L. Mosher, Apalachin, NY (US);
Susan Pitely, Vestal, NY (US);
Jose A. Rios, Binghamton, NY (US);
Norman A. Card, Lockwood, NY (US);
Robert J. Harendza, Lisle, NY (US);
John J. Konrad, Endicott, NY (US);
Tonya L. Mosher, Apalachin, NY (US);
Susan Pitely, Vestal, NY (US);
Jose A. Rios, Binghamton, NY (US);
Endicott Interconnect Technologies, Inc., Endicott, NY (US);
Abstract
A method of making a circuitized substrate in which conductors are formed in such a manner that selected ones of the conductors include solder while others do not and are thus adapted for receiving a different form of connection (e.g., wire-bond) than the solder covered conductors. In one embodiment, the solder may be applied in molten form by immersing the substrate within a bath of the solder while in another the solder may be deposited using a screening procedure.