Hokkaido, Japan

Rinzo Kayano

USPTO Granted Patents = 9 


 

Average Co-Inventor Count = 4.6

ph-index = 2

Forward Citations = 5(Granted Patents)


Location History:

  • Tokyo, JP (2021)
  • Hokkaido, JP (2018 - 2022)
  • Muroran, JP (2005 - 2023)

Company Filing History:


Years Active: 2005-2023

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9 patents (USPTO):

Title: Rinzo Kayano: Innovator in Bonded Substrate Technology

Introduction

Rinzo Kayano is a prominent inventor based in Hokkaido, Japan. He has made significant contributions to the field of bonded substrate technology, holding a total of nine patents. His work focuses on the development of advanced materials that enhance the performance of electronic devices.

Latest Patents

Among his latest patents are innovations such as the bonded substrate, surface acoustic wave element, surface acoustic wave element device, and a method for manufacturing bonded substrates. The bonded substrate consists of a quartz substrate and a piezoelectric substrate, which are covalently coupled at the bonding interface. This unique design allows for the propagation of surface acoustic waves, with the orientations of the quartz and piezoelectric substrates intersecting at specific angles. The manufacturing method involves irradiating the bonding surfaces with ultraviolet light under low pressure, followed by contact and pressurization to achieve a strong bond.

Career Highlights

Rinzo Kayano has worked with notable companies, including The Japan Steel Works, Ltd. and Mitsubishi Chemical Corporation. His experience in these organizations has contributed to his expertise in materials science and engineering.

Collaborations

Throughout his career, Kayano has collaborated with esteemed colleagues such as Kouhei Kurimoto and Kazuhito Kishida. These partnerships have fostered innovation and the exchange of ideas in the field of bonded substrates.

Conclusion

Rinzo Kayano's contributions to bonded substrate technology have positioned him as a key figure in the industry. His innovative patents and collaborations continue to influence advancements in electronic materials.

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