The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 03, 2023
Filed:
Jun. 07, 2018
Applicant:
The Japan Steel Works, Ltd., Tokyo, JP;
Inventors:
Kouhei Kurimoto, Muroran, JP;
Kazuhito Kishida, Tokyo, JP;
Rinzo Kayano, Muroran, JP;
Jun Mizuno, Tokyo, JP;
Shoji Kakio, Kofu, JP;
Assignee:
THE JAPAN STEEL WORKS, LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01);
U.S. Cl.
CPC ...
H03H 9/02574 (2013.01); H03H 3/08 (2013.01); H03H 9/02551 (2013.01); H03H 9/02559 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01);
Abstract
A bonded substrate includes a quartz substrate and a piezoelectric substrate which is bonded on the quartz substrate and on which a surface acoustic wave propagates, wherein the quartz substrate and the piezoelectric substrate are bonded by covalently coupling at a bonding interface, and an orientation of the quartz substrate and an orientation of the piezoelectric substrate intersect with each other on an orthogonal direction side or in the range of 65 degrees to 115 degrees in a bonding surface direction.