The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 15, 2022

Filed:

May. 15, 2019
Applicant:

The Japan Steel Works, Ltd., Tokyo, JP;

Inventors:

Kouhei Kurimoto, Hokkaido, JP;

Kazuhito Kishida, Tokyo, JP;

Rinzo Kayano, Hokkaido, JP;

Jun Mizuno, Tokyo, JP;

Shoji Kakio, Yamanashi, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/08 (2006.01); H03H 9/25 (2006.01); H03H 9/64 (2006.01); H01L 41/312 (2013.01);
U.S. Cl.
CPC ...
H03H 9/02551 (2013.01); H01L 41/312 (2013.01); H03H 3/08 (2013.01); H03H 9/02559 (2013.01); H03H 9/02574 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01); Y10T 29/42 (2015.01);
Abstract

A method of manufacturing a bonded substrate, which has a quartz substrate and a piezoelectric substrate bonded, includes irradiating a bonding surface of the quartz substrate and a bonding surface of the piezoelectric substrate with ultraviolet light under a pressure lower than atmosphere pressure. After the irradiation, the bonding surface of the quartz substrate and the bonding surface of the piezoelectric substrate are brought into contact. And the quartz substrate and the piezoelectric substrate are pressurized in a thickness direction to bond the bonding surfaces.


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