The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 25, 2006

Filed:

Jul. 01, 2004
Applicants:

Yoru Wada, Muroran, JP;

Tatsuo Hasegawa, Muroran, JP;

Rinzo Kayano, Muroran, JP;

Hirokazu Inoue, Minato-ku, JP;

Inventors:

Yoru Wada, Muroran, JP;

Tatsuo Hasegawa, Muroran, JP;

Rinzo Kayano, Muroran, JP;

Hirokazu Inoue, Minato-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 37/00 (2006.01); G06F 19/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Using information about the position, orientation, and shape of a crack appeared in a judged material and information about the structure of the judged material as parameters, the stress intensity factor Kof the crack is found. Based on the stress intensity factor K, hydrogen embrittlement cracking of the judged material is judged. The crack growth rate and possibility of brittle fracture can be judged by comparing the stress intensity factor Kwith the critical stress intensity factor Kfor crack initiation or the critical stress intensity factor Kfor brittle fracture about the temper embrittled steel which absorbs approximately 2.0 ppm hydrogen.


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