Rich Fogal

This inventor holds 68 USPTO granted patents, primarily in Interconnect Packaging (CPC class H01L). Top assignees: Micron Technology Incorporated, Micron Semiconductor, Inc.. Active years: 1992-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Rich Fogal. Retrieved from https://idiyas.com/inventor/rich-fogal

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 68

% Patents Active = 80.9

Average Co-Inventor Count = 2.1

ph-index = 16

Forward Citations = 1,389(Granted Patents)

Forward Citations (Not Self Cited) = 1,328(Dec 10, 2025)

Inventors with similar research interests:

Location History:

McCall, ID (US) (2007 - 2015)
Boise, ID (US) (1992 - 2022)

Company Filing History:

65 out of 39,222

Micron Technology Incorporated

patents

3 out of 156

Micron Semiconductor, Inc.

patents

Years Active: 1992-2022

Loading Chart...

Areas of Expertise:

Proximity Coupling

Wire Bonding

Microdevices

Ball Bonds

Lead Frame

Stacked Die

Flip-Chip

Bondhead Clamp

Semiconductor

Automated Methods

Memory Matrix

Precision Tools

68 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11398465 - Proximity coupling interconnect packaging systems and methods (2022-07-26),

2. 10381336 - Proximity coupling interconnect packaging systems and methods (2019-08-13),

3. 10062678 - Proximity coupling of interconnect packaging systems and methods (2018-08-28),

4. 9595513 - Proximity coupling of interconnect packaging systems and methods (2017-03-14),

5. 8987885 - Packaged microdevices and methods for manufacturing packaged microdevices (2015-03-24),

6. 8354301 - Packaged microdevices and methods for manufacturing packaged microdevices (2013-01-15),

7. 7977597 - Wire bonders and methods of wire-bonding (2011-07-12),

8. 7868440 - Packaged microdevices and methods for manufacturing packaged microdevices (2011-01-11),

9. 7227095 - Wire bonders and methods of wire-bonding (2007-06-05),

10. 6991970 - Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of semiconductor device (2006-01-31),

11. 6886734 - Device and method for clamping and wire-bonding the leads of a lead frame one set at a time (2005-05-03),

12. 6884657 - Angularly offset stacked die multichip device and method of manufacture (2005-04-26),

13. 6845898 - Bondhead lead clamp apparatus (2005-01-25),

14. 6837418 - Bondhead lead clamp apparatus and method (2005-01-04),

15. 6793749 - Automated method of attaching flip-chip devices to a substrate (2004-09-21),

Title: The Innovative Journey of Rich Fogal

Introduction: Rich Fogal, a talented inventor hailing from Boise, ID, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Rich Fogal's latest patents include a cutting-edge software application for enhancing cybersecurity measures in cloud computing systems and a revolutionary device for optimizing energy consumption in smart homes.

Career Highlights: With over two decades of experience in the tech industry, Rich Fogal has a proven track record of developing innovative solutions that have garnered international acclaim. His work has been instrumental in shaping the future of digital security and sustainable living.

Collaborations: Throughout his career, Rich Fogal has collaborated with leading tech companies, research institutions, and universities to push the boundaries of technological advancement. His ability to work seamlessly in interdisciplinary teams has led to the successful implementation of several groundbreaking projects.

Conclusion: Rich Fogal's passion for innovation and his relentless pursuit of excellence continue to inspire the next generation of inventors. His dedication to creating solutions that address real-world challenges underscores his status as a visionary in the field of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]