Boise, ID, United States of America

Rex A Smith


Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 116(Granted Patents)


Company Filing History:


Years Active: 1999-2002

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7 patents (USPTO):Explore Patents

Title: Rex A Smith: Innovator in Thermal Conditioning Technology

Introduction

Rex A Smith is a notable inventor based in Boise, ID (US), recognized for his contributions to thermal conditioning technology. With a total of 7 patents, Smith has made significant advancements in the field, particularly through his innovative designs and methods.

Latest Patents

Among his latest patents, Smith has developed a thermal conditioning apparatus that features a support including a plate with a top surface and a receiving hole. This apparatus incorporates a lift element with a contacting end that is disposed through the receiving hole, along with a sensor located in a bore in the contacting end of the lift element. Additionally, he has patented a method for disposing a wafer on a support member that protrudes from a surface. This method involves supporting the wafer in a first position defined by a lift extending through the surface and manipulating the surface to place the wafer on the support member.

Career Highlights

Rex A Smith is currently employed at Micron Technology Incorporated, where he continues to innovate and contribute to the field of thermal conditioning. His work at Micron has allowed him to collaborate with other talented professionals and further enhance his expertise.

Collaborations

Some of his notable coworkers include Timothy A Strodtbeck and John S Molebash, who have worked alongside Smith on various projects within the company.

Conclusion

Rex A Smith's contributions to thermal conditioning technology through his patents and work at Micron Technology Incorporated highlight his role as a significant innovator in the field. His ongoing efforts continue to shape advancements in this area.

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