Thermal conditioning apparatus

Abstract

Apparatuses are provided for thermally conditioning material. The apparatus includes a plate having a top surface for receiving material, a temperature controller connected to control the temperature of the top surface of the plate and the temperature controller is controlled by a computer controller. In a preferred embodiment, three tubular shaped ceramic support members, each containing a bore, are provided to support the material and a negative pressure source is provided in fluid communication with the bores. In addition, three lift elements having contacting ends are slidably disposed through receiving holes in the thermal conditioning plate and aligned to support the material on the contacting ends. Preferably, at least one of the lift pins contains a bore with a sensor positioned to detect the presence of material on the contacting end of the lift pin and provide a signal to the computer controller that can be used to control the negative pressure source and the relative movement of the plate and lift pins. Also, in a preferred embodiment, the apparatus includes an exhausted cover providing for a stagnation region adjacent to the material during operation, thereby providing for more uniform heat transfer to the material.