Ray Fredric Solis De Asis

Title: Innovations of Ray Fredric Solis de Asis in Semiconductor Technology

Introduction

Ray Fredric Solis de Asis is an accomplished inventor based in Mabalacat, Philippines, known for his significant contributions to semiconductor technology. With a total of three patents to his name, he has developed innovative solutions that enhance the functionality and reliability of semiconductor packages.

Latest Patents

Solis de Asis's latest patents include notable inventions that address key challenges in semiconductor packaging. His first patent, titled "Plated walls defining mold compound cavities," details a semiconductor package comprising a wafer chip scale package (WCSP) that features circuitry on its device side and an insulative layer above it. This design incorporates vertically extending plated walls that form a defined space, effectively preventing mold compound from infiltrating this area. The WCSP is designed with mold compound that abuts the surfaces of these plated walls while providing a conductive terminal that connects to the circuitry and extends into the defined space.

Another significant invention is "Textured bond pads," where he proposes a semiconductor package that includes a semiconductor die equipped with a bond pad featuring a protrusion on its top surface. This bond pad works in conjunction with a metal contact and a bond wire that connects the protrusion to the metal contact, ensuring effective connectivity and performance in the semiconductor package.

Career Highlights

Ray Fredric Solis de Asis is associated with Texas Instruments Corporation, a leading company in the semiconductor industry. His work in this organization embodies his commitment to advancing technology through innovative packaging solutions.

Collaborations

Throughout his career, Solis de Asis has collaborated with talented coworkers such as Rafael Jose Lizares Guevara and Aniceto Tabangcura Rabilas, Jr. Together, they have shared insights and expertise, contributing to the success of innovative projects within the company.

Conclusion

Ray Fredric Solis de Asis exemplifies the spirit of innovation within the semiconductor industry. His patents not only showcase his technical proficiency but also highlight his dedication to improving device performance through inventive engineering solutions. As technology continues to evolve, the contributions of inventors like Solis de Asis play a pivotal role in shaping the future of electronics.