The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 07, 2023
Filed:
Jun. 23, 2021
Applicant:
Texas Instruments Incorporated, Dallas, TX (US);
Inventors:
Rafael Jose Lizares Guevara, Makati, PH;
Aniceto Tabangcura Rabilas, Jr., Baguio, PH;
Ray Fredric Solis de Asis, Mabalacat, PH;
Sylvester Tigno Sanchez, Manila, PH;
Alvin Lopez Andaya, Calasiao, PH;
Assignee:
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 24/05 (2013.01); H01L 21/56 (2013.01); H01L 23/4952 (2013.01); H01L 24/03 (2013.01); H01L 24/85 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03831 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05017 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05573 (2013.01); H01L 2224/05664 (2013.01);
Abstract
In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.