Texas Instruments Corporation

Ray Fredric Solis De Asis

Rafael Jose Lizares Guevara

Sylvester Tigno Sanchez

Alvin Lopez Andaya

Aniceto Tabangcura Rabilas, Jr

John Carlo Cruz Molina

Julian Carlo Concepcion Barbadillo

In examples, a semiconductor package comprises a wafer chip scale package (WCSP) having circuitry formed in a device side and an insulative layer above the device side. The WCSP includes one or more plated walls extending vertically to form a defined space, the one or more plated walls configured to prevent mold compound from flowing into the defined space. The WCSP includes mold compound abutting surfaces of the one or more plated walls opposing the defined space. The WCSP includes a conductive terminal coupled to the circuitry and extending from the WCSP into the defined space.

Plated walls defining mold compound cavities

In some examples, a package comprises a semiconductor die and a bond pad formed upon the semiconductor die. The bond pad has a protrusion on a top surface of the bond pad. The package also comprises a metal contact and a bond wire coupled to the protrusion and to the metal contact.

Textured bond pads

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Mabalacat, Philippines

Ray Fredric Solis De Asis