IDiyas

For the Inventor, By the Inventor

Hyderabad Telangana, India

Ravindranath Doddi

USPTO Granted Patents = 14 

Average Co-Inventor Count = 4.5

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:

goldMedal14 out of 41,326 
 
Qualcomm Incorporated
 patents

Years Active: 2024-2025

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14 patents (USPTO):Explore Patents
1. 12430280 - Mechanism to improve the reliability of sideband in chiplets (2025-09-30),
2. 12430199 - Flow control between peripheral component interconnect express devices (2025-09-30),
3. 12423252 - Systems and methods for reducing latency and improving performance in a peripheral component interconnect express (PCIe) system (2025-09-23),
4. 12417196 - Systems and methods for reducing latency and power consumption in a peripheral component interconnect express (PCIe) system (2025-09-16),
5. 12399853 - Mechanism to improve link initialization time (2025-08-26),
6. 12386382 - Reduced training for main band chip module interconnection clock lines (2025-08-12),
7. 12380047 - Expanded data link width for main band chip module connection in alternate modes (2025-08-05),
8. 12373359 - Mechanism to enhance PCIe generation switching (2025-07-29),
9. 12314204 - Single clock lane operation for a main band of a die-to-die connection (2025-05-27),
10. 12164448 - Mechanism to reduce exit latency for deeper power saving modes L2 in PCIe (2024-12-10),
11. 12153527 - Data rate increase for faulty lane recovery in multiple lane data links (2024-11-26),
12. 12079061 - Power management for peripheral component interconnect (2024-09-03),
13. 12019577 - Latency reduction for link speed switching in multiple lane data links (2024-06-25),
14. 11934335 - Power management for peripheral component interconnect (2024-03-19),

Title: The Innovative Contributions of Ravindranath Doddi

Introduction

Ravindranath Doddi is a prominent inventor based in Hyderabad, Telangana, India. He has made significant contributions to the field of technology, particularly in the area of chiplet interconnects and data transmission. With a total of 14 patents to his name, Doddi continues to push the boundaries of innovation.

Latest Patents

One of his latest patents is focused on a mechanism to improve the reliability of sideband in chiplets. This invention includes various methods and devices for implementing Universal Chiplet Interconnect Express (UCIe) link configuration for multi-module chiplets of a computing device. The embodiments may involve transitioning a UCIe link from an active state with a first sideband to a reset state, initializing at least one different functional sideband. Additionally, it includes reading sideband data to represent functional sidebands and initializing them accordingly.

Another notable patent addresses flow control between peripheral component interconnect express devices. This invention provides techniques for retransmitting transaction layer packets (TLPs) for which a negative acknowledgment (NACK) is received. The system allows a receiver to notify a transmitter about packets for retransmission while purging correctly received packets that are out-of-sequence.

Career Highlights

Ravindranath Doddi is currently employed at Qualcomm Incorporated, a leading company in the technology sector. His work at Qualcomm has allowed him to develop innovative solutions that enhance the performance and reliability of computing devices.

Collaborations

Doddi has collaborated with talented individuals such as Santhosh Reddy Akavaram and Prakhar Srivastava. These collaborations have contributed to the successful development of his patents and innovations.

Conclusion

Ravindranath Doddi's contributions to technology through his patents demonstrate his commitment to innovation and excellence. His work continues to influence the field, paving the way for future advancements in computing technology.

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